Advanced Custom/Analog/AMS Layout

• Mismatches and matching
• Failure mechanism which includes EM, IR, LOP and Stress, WPE, Antenna, Latchup, ESD( HV, EOS)
• Noise and coupling
• Types of processes- CMOS, FINFET, FD-SOI, BI-CMOS, Silicon and Gallium arsenide
• Full Chip Construction including Scribe, Seal ring, Pad frame, Integration of IP’s
• Packaging
• Touch base of IO and memory layout and how its different than analog layout